HardTop Sealer
السعر عند الطلب
كلّ منتجات المتجر ←
الوصف
Two-component acrylic-polyurethane sealer
المواصفات
| العبوة | Component A 3.6 L in metal can. Component B 0.9 L in metal can |
| اللون | Hazy |
| Application Instruction — Mixing Ratio | (by volume) Comp.A Comp.B Thinner (S507 “known as Acrysol”) 4 1 0.75 Note: Dilution by thinner S507 is recommended only if conventional spray application is used. No dilution is required for airless spray application |
| Application Instruction — Mixing | Stir well before application in order to ensure that a uniform consistency is achieved. Material which has begun to set must be discarded |
| Application Instruction — Pot life | 2 hours (higher temperatures will shorten the potlife sharply) |
| Technical Information — Volume Solids | 30.9 % (ASTM-D2697) |
| Technical Information — Flexibility | Excellent |
| Technical Information — Recommended film thickness | 30-50 microns “dry” |
| التغطية (م²/لتر) | 7.7 m2/L at 40 microns “dry” |
| Technical Information — Water resistance | Excellent |
| Technical Information — Abrasian Resistance | Excellent |
| Technical Information — Chemical Resistance | Good |
| عدد الطبقات | 1-3 |
| Technical Information — Specific Gravity (mixed) | 0.97 kg/L (DIN 51757) |
| زمن الجفاف | 24 hours “minimum recoat time” (ASTM-D1640) |
| Drying Time — Note | Drying times can be affected by many factors such as temperature, ventilation and coat thickness. Higher temperatures will shorten the drying times |
| Application Instruction — Cleaner | Clean applying tools by thinner S507 “known as Acrysol” |
| Application Instruction — Note | When recoating, a special attention should be given toward drying times. Coated surfaces by HARDTOP Lacquer should not be exposed to water, chemicals, or mechanical stresses before it is fully cured |
| Application Instruction — Curing | The reaction between components A and B can not be guaranteed unless a temperature of at least 10°C is maintained for the mixture and the substrate until complete curing. Temperature of substrate should be at least 3°C above the dew point to avoid moisture condensation during application |
| Technical Information — Solvent Splash and Spill Resistance | Fair |