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EPX55

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الوصف

EPX 55 is a three-component solvent-free epoxy filler used mainly for concrete repair and protection

المواصفات

العبوة Component A “base” 1800 g in US Gallon Component B “drier” 960 g in US Quart
اللون Gray
الرمز EPX55
Application Instruction — Mixing Ratio (by weight) 3 to 1.6 (A to B)
Application Instruction — Mixing The individual components of EPX55 should be thoroughly stirred before the two are mixed together. Combine components (A & B) in supplied proportions and mix thoroughly using a slow speed mixer for at least 3 minutes to achieve uniform consistency; "DO NOT USE HIGH SPEED MIXER". Never mix more mater
Application Instruction — Pot life Temperatures (° C) Potlife (minutes) 40 10 30 20 20 40 10 90
Application Instruction — Thinner / Cleaner Do not thin. Due to potlife limitations, clean all mixing equipment and application tools by thinner S405 "known as Epoxsol" immediately after application is completed
Technical Information — Volume Solids 100 % (ASTM-D2697)
Technical Information — Flexibility Excellent
Technical Information — Recommended film thickness 250 microns “dry”
التغطية (م²/لتر) 4 m²/L at 250 microns “dry”
Technical Information — Water resistance Excellent
Technical Information — Abrasian Resistance Excellent
Technical Information — Chemical Resistance Very good
Technical Information — Solvent Resistance Very good
عدد الطبقات 1-2
Technical Information — Specific Gravity (mixed) 1.7 kg/L (ASTM-D1475)
زمن الجفاف 24 hours (ASTM-D1640)
Drying Time — Fully Cured 7 days
Technical Information — Compressive Strength 450-500 kg/cm²
Technical Information — Note Tensile strength with concrete:35 kg/cm² Tensile strength with steel :150 kg/cm² All values are obtained after full cure (7 days at 20° C). In case of EPX55 is used to embed steel bars in concrete, the table below shows the relationship between the maximum tensile load (taking in consideration the s
Application Instruction — Curing The reaction between the epoxy and its curing agent (A & B) can not be guaranteed unless a temperature of at least 10° C is maintained for the mixture and the substrate until complete curing. Temperature of substrate should be at least 3°C above dew point to avoid moisture condensation during applic
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